Talk at the European Radar Conference 2017
Abstract
The increasing adoption of millimeter-wave (mmWave) sensors in automotive radar, industrial, and consumer applications demands advanced packaging technologies that balance performance, cost, and scalability. This talk explores the state-of-the-art in RF and mmWave packaging solutions, highlighting key approaches such as wire bonding, wafer-level packaging, flip-chip mounting, and chip embedding.
We will discuss the critical packaging requirements for high-frequency applications, including antenna integration, low-loss interconnects, and thermal and mechanical considerations. Wire bonding, while a mature and cost-effective solution, faces scalability challenges at high frequencies. Wafer-level packaging offers a viable alternative, especially for high-volume applications, but comes with design constraints related to RF performance. Flip-chip technology enables compact integration and improved RF characteristics but requires advanced substrates. Embedding techniques, including direct die embedding, present innovative opportunities for further miniaturization but face challenges in industrial adoption.
The session will conclude with an outlook on emerging trends, such as panel-level packaging and 3D printing, which promise to further drive cost reduction and performance enhancements. Attendees will gain insights into the trade-offs of different packaging approaches and the evolving landscape of mmWave sensor integration.